The recent GTC event showcased significant advancements in high-bandwidth memory (HBM) technologies, with Samsung, SK Hynix, and Micron previewing their upcoming HBM4 and HBM4e solutions that promise enhanced density and bandwidth for data center GPUs. These developments are crucial for supporting the growing demands of AI workloads, particularly as Nvidia prepares for its powerful Rubin GPUs set to launch by 2027.
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